Precision-Cooled
Performance Block
Precision-Cooled. Performance-Driven
Aegis delivers the industry’s first full-stack, two-phase flow boiling, liquid cooling system, engineered for today’s most demanding compute environments.
This closed-loop, modular solution provides unmatched cooling density, real-time responsiveness, and rapid scalability — from edge to hyperscale.
Built to scale. Built for AI.
3D-Printed Microchannel Plate
One Print. No Compromise
Aegis cold plates are fully 3D-printed in a single pass — no welding, no assembly, and no thermal tradeoffs.
Our thin-wall, microchannel design delivers ultra-compact, high-efficiency heat transfer with:
- 50% lower thermal resistance than machined plates
- Up to 80% material savings and significantly reduced weight
- Custom geometries for emerging chip architectures
Additive by nature. Aggressive by performance.
Direct Vaporization at the Heat Source
Boil Where It Matters
Aegis uses two-phase flow boiling directly on-chip — combining the best of boiling and forced convection. By flow boiling, we could achieve:
- Instant thermal responsiveness
- Lower junction temps and tighter deltas
- Stable and Consistent flow inside the microchannel
It’s not immersion. It’s precision.
Development Speed & Lead Time
Thermal Design in Days. Not Months
From digital simulation to printed cold plate prototype, our thermal development cycle is measured in days, not quarters.
- Full DfAM (Design for Additive Manufacturing) flow
- 7-day concept-to-print turnaround
- U.S.-built systems delivered in 60 days
- No MOQs — scale up when you’re ready
Engineered for iteration. Built for acceleration.
Agile Manufacturing
Global Supply Chain? No Thanks
Aegis eliminates tooling delays and freight bottlenecks with localized, just-in-time production.
- Metal 3D printing replaces CNC queues
- Materials sourced from U.S. and EU
- 48-hour SLA on critical spares
- 60-day lead time from order to rack-ready system
From design to deployment — without crossing an ocean.
Sustainability
Zero Water. Near-Zero Waste
Aegis liquid cooling is as efficient for the planet as it is for your servers.
- Closed-loop dielectric means WUE = 0
- Additive manufacturing eliminates machining waste
- pPUE could be as low as 1.05
- No immersion oils, no drain tanks, no hazardous handling
- Reduced shipping and packaging footprint
High performance, low impact.
Performance Metrics (Stats)
Quantified. Verified. Delivered.
Aegis is built for measurable, repeatable, real-world results.
| Metric | Performance |
|---|---|
| Thermal Resistance | ↓50% vs CNC plates |
| Design-to-Print Time | 7 days |
| System Lead Time | 60 days |
| Water Usage | 0 L (WUE = 0) |
| pPUE | ≥ 1.05 |
| Material Efficiency | ↑80% (via 3D printing) |
This is what next-gen cooling looks like in numbers.
Technology + Awards Overview
Built to Win. Proven to Lead
Aegis technology is trusted by the world’s most demanding compute environments — and recognized globally for innovation.
Recent awards and industry validation:
- DCR Excellence Award 2025 – Data Centre Cooling Product of the Year
- Frost & Sullivan 2025 – North American Cooling Company of the Year
Backed by Airsys, built by the team delivering next-gen AI thermal infrastructure.
Recognized. Reliable. Ready to scale.
Ready to Print Your Thermal Future?
Engineer Your AI/HPC Thermal Strategy with Aegis