TurboPlate™
3D-Printed Heat Sinks Reborn
3D-Printed TurboPlates™
5000W AI Cooling Solved
Direct-to-Chip Two-Phase Cooling x 3D-Printed TurboPlate™
Manufactured in the USA, engineered for 5000W TDP era
Why Direct-To-Chip?
AI Heat Is Rising Beyond Limits
Heat density is now the biggest bottleneck in AI infrastructure. NVIDIA forecasts a 4x increase in heat output from 2025 to 2027 — doubling every 6 months. Traditional cooling just can’t keep up.
Aegis’ Solution
- Two-Phase Evaporation Direct CPU contact results in faster heat transfer
- 3D-Printed TurboPlate™ customisable solution with decentralised manufacturing
- VaporCool-X™ Leak-proof + dual-pump redundancy
TurboPlate™ Chip-Level Engine
TurboPlate™ Core Advantages
- 3D-Printed Microchannels – 50% lower Rth vs CNC machining
- Two-Phase Supercooling – Designed to Handle Next-Generation AI Thermal Loads
- Rapid US Production – 80% Reduction in Design Validation Time,50% Shorter Supply Lead Time Over Legacy Cooling Approaches
TurboPlate™ Chip-Level Engine
Customer Outcomes
- Ultra-sustained chip performance upto 5000W TDP
- Faster thermal solution iteration
- More rack space/energy savings
- Zero logistics risk
This thermal breakthrough redefines AI cooling
“As next-generation GPUs push the boundaries of power and cooling, Airsys sets itself apart with its innovative 3D-printed, two-phase microchannel heat sinks, engineered to tackle these challenges. Specifically designed for high-density, high-power GPUs, this advanced solution optimizes heat rejection and reuse, ensuring superior thermal management and energy efficiency.”
— Frost & Sullivan, 2025
VaporCool-X™ Intelligent Vapor Control
VaporCool-X™: Rack-Smart Cooling Control
VaporCool-X™ is the first in the industry to adopt patented Vapor Quality.
Control technology. This innovation enables real-time regulation of vapor phase change, ensuring dynamic balance between fluctuating IT loads and pump speeds for optimized thermal performance.
Energy-Efficient Pumping
Variable-speed refrigerant pump reduces power consumption by up to 50%.
Improved PUE
Lower system power use leads to better overall energy efficiency.
Key Tech Features
- Dual-pump safety: 100% uptime with <1s leak shutdown
- “Click-to-cool” expansion for new AI servers
- 100% US-sourced critical components
Customer Outcomes
- Unlock 250kW/Rack Thermal Headroom – Redefine AI ROI Timelines
- CapEx Scales alongside Tensor Demands – Not Cooling Limits
VaporCool-X™ Safety & Scalability
- <1s Leak Lockdown – Auto-sensors trigger instant flow cutoff
- Zero Downtime – Dual pumps & power feeds switch seamlessly
- Hybrid Cooling – Air-liquid synergy for non-chip components
- Rack-Ready – Slide-in modules, zero infrastructure changes
TurboPlate™ + VaporCool-X™ = Total Thermal Control
From CPU to data hall: 3D-printed microchannels extract heat at the source, smart VaporCool-X™ circulate and monitor coolant, and recovered heat is repurposed — enabling predictable thermals, accelerated deployments, and a reduced carbon footprint.
Sustainability Built on Data, Backed by Science
- Water-Free Operation (WUE = 0)
- 80% Material Efficiency with Additive Manufacturing
- Battle-Tested in: MRI Systems | Semiconductor Lithography | Hyperscale AI
- Onshore Production Secures Supply Chains
Cooling Redefined
Printed for Peak Performance